4 Specifications

4.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VCC

Supply voltage range

–0.5

6

V

IIK

Input clamp current(2)

VI < 0 or VI > VCC

±20

mA

IOK

Output clamp current(2)

VO < 0

–50

mA

IO

Continuous current

±50

mA

Tstg

Storage temperature range

–65

150

°C

(1)

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The input and output negative voltage ratings may be exceeded if the input and output current ratings are observed.

4.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

4.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)

TA = 25°C

–40°C TO

85°C

–55°C TO

125°C

UNIT

MIN

MAX

MIN

MAX

MIN

MAX

VCC

Supply voltage

4.5

5.5

4.5

5.5

4.5

5.5

V

VIH

High-level input voltage

2

2

2

V

VIL

Low-level input voltage

0.8

0.8

0.8

V

VI

Input voltage

0

VCC

0

VCC

0

VCC

V

VO

Output voltage

0

5.5

0

5.5

0

5.5

V

IOL

Low-level output current

24

24

24

mA

Δt/Δv

Input transition rise or fall rate

10

10

10

ns/V

(1)

All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,

Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

4.4 Thermal Information

THERMAL METRIC(1)

CD74ACT05

UNIT

BQA

(WQFN)

D

(SOIC)

N

(PDIP)

PW

(TSSOP)

14 PINS

RθJA

Junction-to-ambient thermal resistance

85.4

89.9

80

132.2

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

CD54ACT05, CD74ACT05

SCHS311E – JANUARY 2001 – REVISED NOVEMBER 2024

www.ti.com

4

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