Data Sheet

AD8317

Rev. D | Page 19 of 19

OUTLINE DIMENSIONS

0.30

0.23

0.18

0.203 REF

0.80

0.75

0.70

1.89

1.74

1.59

0.50 BSC

0.20 MIN

0.60

0.45

0.30

0.55

0.40

0.30

BOTTOM VIEW

4

1

5

8

3.25

3.00

2.75

2.25

2.00

1.75

TOP VIEW

0.05 MAX

0.02 NOM

EXPOSED PAD

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET

P IN 1

IN D IC ATO R AR E A OP T IO N S

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

SEATING

PLANE

SIDE VIEW

PIN 1

INDICATOR

AREA

Figure 40. 8-Lead Lead Frame Chip Scale Package [LFCSP]

2 mm × 3 mm Body and 0.75 mm Package Height

(CP-8-23)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

Marking Code

AD8317ACPZ-R7

−40°C to +85°C

8-Lead LFCSP, 7”Tape and Reel

CP-8-23

Q1

AD8317ACPZ-R2

−40°C to +85°C

8-Lead LFCSP, 7”Tape and Reel

CP-8-23

Q1

AD8317ACPZ-WP

−40°C to +85°C

8-Lead LFCSP, Waffle Pack

CP-8-23

Q1

AD8317ACHIPS

−40°C to +85°C

Die

AD8317-EVALZ

Evaluation Board

1 Z = RoHS Compliant Part.

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registered trademarks are the property of their respective owners.

D05541-0-9/19(D)