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9.6 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

9.7 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

10 Revision History

Changes from March 22, 2024 to September 30, 2024 (from Revision * (March 2024) to

Revision A (September 2024))

Page

• Global: Changed the document product status from "Advance Information" to "Production Data"................... 1

• (Features): Added "Motion JPEG encode" feature.............................................................................................1

• (Features/Media and Data Storage): Updated/Changed the "… eMMC interface up to HS200 speed" to "… up

to HS400 speed".................................................................................................................................................1

• (Features): Updated/Changed the CSI2.0 bullet and added sub-bullets............................................................1

• (Applications): Add End Equipment (EE) ulinks to the Applications list..............................................................3

• (Functional Block Diagram): Updated the ulink to the TI Software Development Kits (SDKs)........................... 4

• (Functional Block Diagram): Added a "JPEG Encode" block to the Multimedia main block...............................4

• (Device Comparison): Updated the ulink to the TI Software Development Kits (SDKs) in the "To understand

what device features are currently supported by TI Software Development Kits. …" Note................................6

• (Device Comparison): Add the "Motion JPEG Encoder" row to the table...........................................................6

• (SDIO Electrical Characteristics): Changed VDDSHV5 power rail name, where applicable, used to define the

VIL/VILSS/VIH/VIHSS/VOL/VOH parameter values by referencing a generic power rail name (VDD), and added an

associated table note........................................................................................................................................89

• (Recommended Operating Conditions for OTP eFuse Programming): Changed the "VPP Slew Rate"

parameter name to "VPP Power-up Slew Rate" to clarify the limit associated with this parameter only applies

during power-up................................................................................................................................................92

• (Power-Up Sequencing): Added note to clarify power rails must decay below 300mv before initiating a new

power-up sequence.......................................................................................................................................... 97

• (Power-Down Sequencing): Added note to clarify power rails must decay below 300mv before initiating a new

power-up sequence........................................................................................................................................ 100

• (BOOTMODE Timing Requirements): Updated the description for parameters RST23 and RST24............. 103

• (MCU_OSC0 LVCMOS Digital Clock Source): Added the new MCU_OSC0 LVCMOS Digital Clock Source

Requirements table.........................................................................................................................................115

• (CPSW3G RGMII Timing Conditions): Added operating voltage conditions to the Input Slew Rate parameter

to allow a relaxed slew rate when operating at 1.8V...................................................................................... 127

• (I2C): Changed the maximum slew rate value from 0.8V/ns to 0.08V/ns and added "when operating at 3.3V"

to clarify the exception is not applicable to 1.8V operation.............................................................................163

• (MMC0 Timing Requirements – HS400 Mode): Changed the maximum values associated with parameters

HS4001, HS4002, HS4003, and HS4004 from 500 to 475............................................................................ 182

• (MMC0 Switching Characteristics – HS400 Mode): Replaced the Delay time parameters HS4008 and

HS4009 with Output setup and Output hold parameters HS4008, HS4009, HS40010, and HS40011.......... 182

• (eMMC in – HS400 Mode – Transmitter Mode): Updated the timing diagram to match the new definitions

associated with parameters HS4008, HS4009, HS40010, and HS40011...................................................... 182

• (Device Nomenclature): Updated/Changed the package type (designator) form "AMH" to "AMW" in the

orderable part numbers paragraph.................................................................................................................224

TDA4VEN-Q1, TDA4AEN-Q1

SPRSP96A – MARCH 2024 – REVISED SEPTEMBER 2024

www.ti.com

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