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STTH5L06 数据表(PDF) 5 Page - STMicroelectronics

部件名 STTH5L06
功能描述  Turbo 2 ultrafast high voltage rectifier
PDF  10 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

STTH5L06 数据表(HTML) 5 Page - STMicroelectronics

  STTH5L06 Datasheet HTML 1Page - STMicroelectronics STTH5L06 Datasheet HTML 2Page - STMicroelectronics STTH5L06 Datasheet HTML 3Page - STMicroelectronics STTH5L06 Datasheet HTML 4Page - STMicroelectronics STTH5L06 Datasheet HTML 5Page - STMicroelectronics STTH5L06 Datasheet HTML 6Page - STMicroelectronics STTH5L06 Datasheet HTML 7Page - STMicroelectronics STTH5L06 Datasheet HTML 8Page - STMicroelectronics STTH5L06 Datasheet HTML 9Page - STMicroelectronics Next Button
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STTH5L06
Characteristics
5/10
Figure 11.
Transient peak forward voltage
versus dIF/dt (90% confidence)
Figure 12.
Forward recovery time versus dIF/dt
(90% confidence)
0
1
2
3
4
5
6
7
8
9
10
0
20
40
60
80
100
120
140
160
180
200
V
(V)
FP
dI /dt(A/µs)
F
I=I
T =125°C
F
F(AV)
j
0
20
40
60
80
100
120
140
160
180
200
0
20
40
60
80
100
120
140
160
180
200
t (ns)
fr
dI /dt(A/µs)
F
I=I
T =125°C
F
F(AV)
j
V
=1.1 x V max.
FR
F
Figure 13.
Junction capacitance versus
reverse voltage applied (typical
values)
Figure 14.
Thermal resistance junction to
ambient versus copper surface
under tab (epoxy FR4, eCU = 35 µm)
(DPAK)
Figure 15.
Thermal resistance junction to
ambient versus copper surface
under each lead (epoxy printed
circuit board FR4, copper
thickness: 35µm) (DO-201AD)
1
10
100
1
10
100
1000
C(pF)
V (V)
R
F=1MHz
V
=30mV
T =25°C
OSC
j
0
2
4
6
8
1012141618
20
0
10
20
30
40
50
60
70
80
R
(°C/W)
th(j-a)
S
(cm²)
CU
0
10
20
30
40
50
60
70
80
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
R
(°C/W)
th(j-a)
DO-201AD
S
(cm²)
CU



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