2

DN2540

Thermal Characteristics

Package

I

D

(mA)

I

D

(pulsed)

(mA)

Power Dissipation

@T

(W)

Θ

jc

Θ

ja

I

DR

(1)

(mA)

I

DRM

(mA)

TO-92

120

500

1.0

125

170

120

500

TO-220

500

500

15

8.3

70

500

500

TO-243AA

170

500

15

170

500

Notes:

(1) I

(2) Mounted on FR5 board, 25mm x 25mm x 1.57mm.

Product Marking

3-Lead TO-243AA (N8)

3-Lead TO-220 (N5)

3-Lead TO-92 (N3)

Sym

Parameter

Min

Typ

Max

Units

Conditions

BV

DSX

Drain-to-source breakdown voltage

400

-

-

V

V

V

GS(OFF)

Gate-to-source OFF voltage

-1.5

-

-3.5

V

V

ΔV

GS(OFF)

Change in V

-

-

4.5

I

GSS

Gate body leakage current

-

-

100

nA

V

I

D(OFF)

Drain-to-source leakage current

-

-

10

µA

V

-

-

1.0

mA

V

V

I

DSS

Saturated drain-to-source current

150

-

-

mA

V

R

DS(ON)

Static drain-to-source ON-state

resistance

-17

25

Ω

V

ΔR

DS(ON)

Change in R

-

-

1.1

G

FS

Forward transconductance

-

325

-

mmho

V

C

ISS

Input capacitance

-

200

300

pF

V

V

f = 1MHz

C

OSS

Common source output capacitance

-

12

30

C

RSS

Reverse transfer capacitance

-

1

5

L = Lot Number

YY = Year Sealed

WW = Week Sealed

= “Green” Packaging

DN2540N5

LLLLLLLLL

YYWW

YY = Year Sealed

WW = Week Sealed

= “Green” Packaging

DN

2540

YYWW

W = Code for week sealed

DN5DW