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Doc.# DSFP-HT18_HT19

A111006

HT18/HT19

(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline

8-Lead SOIC (Narrow Body) LG Package Outline

45°

5° - 15°

(4 PLCS)

4.90 ± 0.10

1.27BSC

6.00 ± 0.20

3.90 ± 0.10

Notes:

1. All dimensions in millimeters. Angles in degrees.

2. If the corner is not chamfered, then a Pin 1 identifier

must be located within the area indicated.

Note 2

1.75 MAX

0.10 - 0.25

0.31 - 0.51

1.25 MIN

0.25 - 0.50

0° - 8°

0.40 - 1.27

0.17 - 0.25

Top View

Side View

End View

Note 2

1

8

Pin Description

Pin

Name Description

1

TPG

Positive input side of a telephone line, typically Tip side.

2

HKS

Hookswitch input. Connect HKS to TPG to turn on the hook switch. Internally pulled low with a high value

resistor.

3

GND

Device ground. Negative side of a telephone line, typically Ring side.

4

NC

No Connect. Open Circuit. No internal connections to the device.

5

LS

Line switch input. Input logic high turns on the hook switch. Internally pulled low with a high value resistor.

6DP

For HT18. Dial pulse input. Input logic high turns off the hook switch. Used for pulse dialing. Internally

pulled low with a high value resistor.

6DP

For HT19. Dial pulse input. Input logic low turns off the hook switch. Used for pulse dialing. Internally

pulled high with a high value resistor.

7

CS

Current sense input. An external resistor connected between CS and TP sets the current limit.

8TP

Positive output side of a telephone line. Zener protection to prevent this output from rising above 18V is

required.