6

 2005 Semtech Corp.

www.semtech.com

SC613

POWER MANAGEMENT

Table 2 -Ripple Performance

T

V

T

U

O

.

q

e

r

F

]

z

H

k

[

e

l

p

p

i

R

t

u

p

u

O

]

p

-

p

V

m

[

d

n

a

A

m

0

0

1

t

a

V

5

.

5

o

t

V

2

.

3

=

n

i

V

V

0

.

5

2

6

25

2

0

5

65

1

V

5

.

4

2

6

25

2

0

5

65

1

Calculating Power Dissipation

The power dissipated by the SC613 is calculated as,

−

⋅

+

(

)

⋅

⋅

−

=

=

Short Circuit and Over Temperature Protection

The output is current limited to 600mA to protect against short

circuit conditions. Over temperature protection is also provided.

Design and Layout Considerations

The center pad “thermal slug” is not internally connected to ground,

but should be connected to ground in the layout through vias con-

necting to the ground plane. Pin 8 can be routed directly to the

center pad. A good ground plane connection is important to make

effective use of the low thermal resistance of the MLP package.

Short Circuit and Over Temperature Protection

The output is current limited to 600mA to protect against short

circuit conditions. Over temperature protection is also provided.

Design and Layout Considerations

The center pad “thermal slug” is not internally connected to ground,

but should be connected to ground in the layout through vias con-

necting to the ground plane. Pin 8 can be routed directly to the

center pad. A good ground plane connection is important to make

effective use of the low thermal resistance of the MLP package.

Applications Information (cont.)