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SC4521 数据表(PDF) 10 Page - Semtech Corporation |
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SC4521 数据表(HTML) 10 Page - Semtech Corporation |
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10 / 18 page ![]() 10 2007 Semtech Corp. www.semtech.com POWER MANAGEMENT SC4521 The design guidelines for the SC4521 applications are as following: 1. Set the loop gain crossover corner frequency ω C for given switching corner frequency ω C = 2πfC 2. Place an integrator at the origin to increase DC and low frequency gains. 3. Select ω Z such that it is placed at ωP1 to obtain a -20dB/dec rate to go across the 0dB line. 4. Place a high frequency compensator pole ω P2 (ωP2 = πfs) to get the maximum attenuation of the switching ripple and high frequency noise with the adequate phase lag at ω C. Layout Guidelines: In order to achieve optimal electrical and thermal performance for high frequency converters, special attention must be paid to the PCB layouts. The goal of layout optimization is to identify the high di/dt loops and minimize them. The following guidelines should be used to ensure proper operation of the converters. 1. A ground plane is suggested to minimize switching noises and trace losses and maximize heat transferring. Application Information (Cont.) 2. Start the PCB layout by placing the power components first. Arrange the power circuit to achieve a clean power flow route. Put all power connections on one side of the PCB with wide copper filled areas if possible. 3. The V IN bypass capacitor should be placed next to the V IN and GND pins. 4. The trace connecting the feedback resistors to the output should be short, direct and far away from any noise sources such as switching node and switching components. 5. Minimize the loop including input capacitor, the SC4521 and freewheeling diode D 2. This loop passes high di/dt current. Make sure the trace width is wide enough to reduce copper losses in this loop. 6. Maximize the trace width of the loop connecting the inductor, freewheeling diode D 2 and the output capacitor. 7. Connect the ground of the feedback divider and the compensation components directly to the GND pin of the SC4521 by using a separate ground trace. 8. Connect Pin 4 to a large copper area to remove the IC heat and increase the power capability of the SC4521. A few feedthrough holes are required to connect this large copper area to a ground plane to further improve the thermal environment of the SC4521. The traces attached to other pins should be as wide as possible for the same purpose. One integrator is added at origin to increase the DC gain. ω Z is used to cancel the power stage pole ωP1 so that the loop gain has –20dB/dec rate when it reaches 0dB line. ω P2 is placed at half switching frequency to reject high frequency switching noises. Figure 4 gives the asymptotic diagrams of the power stage with current loop closed and its loop gain. ωC ωP2 ωZ ωp1 Loop gain T(s) Power stage Figure 4. Asymptotic diagrams of power stage with current loop closed and its loop gain. |
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