13

© 2007 Semtech Corp.

www.semtech.com

POWER MANAGEMENT

SC2596

Outline Drawing - Power SOIC-8L (EDP)

Land Pattern - Power SOIC-8L (EDP)

Y

THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.

CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR

COMPANY'S MANUFACTURING GUIDELINES ARE MET.

NOTES:

1.

REFERENCE IPC-SM-782A, RLP NO. 300A.

2.

INCHES

DIMENSIONS

Z

P

Y

X

DIM

C

G

MILLIMETERS

E

.201

5.10

X

FAILURE TO DO SO MAY COMPROMISE THE THERMAL AND/OR

FUNCTIONAL PERFORMANCE OF THE DEVICE.

SHALL BE CONNECTED TO A SYSTEM GROUND PLANE.

THERMAL VIAS IN THE LAND PATTERN OF THE EXPOSED PAD

3.

F

E

D

SOLDER MASK

THERMAL VIA

?0.36mm

D.098

2.49

F.096

2.44

Z

(C)

G

(.205)

(5.20)

P

3.00

.118

1.27

.050

0.60

.024

2.20

.087

7.40

.291

E

SEE DETAIL

DETAIL

A

A

.050 BSC

.236 BSC

8

.010

.150

.189

.154

.193

.012

-

8

0.25

1.27 BSC

6.00 BSC

3.90

4.90

-

.157

.197

3.80

4.80

.020

0.31

4.00

5.00

0.51

bxN

2X N/2 TIPS

SEATING

aaa C

E/2

2X

12

N

A

D

A1

E1

bbb

C A-B D

ccc C

e/2

A2

(.041)

.004

.008

-

.028

-

-

-

-

0

.016

.007

.049

.000

.053

8

0

0.20

0.10

-

8

0.40

0.17

1.25

0.00

.041

.010

.069

.065

.005

1.35

(1.05)

0.72

-

1.04

0.25

-

-

-

1.75

1.65

0.13

0.25

-

.010

.020

0.50

-

c

L

(L1)

01

0.25

GAGE

PLANE

h

3.

DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS

OR GATE BURRS.

-B-

CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).

DATUMS

AND

TO BE DETERMINED AT DATUM PLANE

NOTES:

1.

2.

-A-

-H-

SIDE VIEW

A

B

C

D

e

H

PLANE

F

F

EXPOSED PAD

L1

N

01

bbb

aaa

ccc

A

b

A2

A1

D

E

E1

L

h

e

c

DIM

MIN

MILLIMETERS

NOM

DIMENSIONS

INCHES

MIN

MAX

MAX

NOM

F

.086.090.0942.192.292.39

h

4.

REFERENCE JEDEC STD MS-012, VARIATION BA.

Contact Information

Semtech Corporation

Power Management Products Division

200 Flynn Road, Camarillo, CA 93012

Phone: (805)498-2111 FAX (805)498-3804