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HT1626 数据表(PDF) 3 Page - Holtek Semiconductor Inc |
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HT1626 数据表(HTML) 3 Page - Holtek Semiconductor Inc |
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3 / 15 page ![]() Pad Assignment Chip size: 242 ´ 196 (mil) 2 * The IC substrate should be connected to VDD in the PCB layout artwork. HT1626 Rev. 1.10 3 September 11, 2002 O S C O O S C I V D D V L C D B Z T 1 T 2 T 3 C O M 0 C O M 1 C O M 2 C O M 3 C O M 4 I R Q B Z 1 4 1 2 4 2 3 4 3 4 4 4 5 4 5 6 4 6 7 4 7 8 4 8 9 4 9 1 0 5 0 1 1 5 1 1 2 5 2 1 3 5 3 1 4 5 4 1 5 5 5 1 6 5 6 1 7 5 7 1 8 5 8 1 9 5 9 2 0 6 0 2 1 6 1 2 2 6 2 2 3 6 3 2 4 6 4 2 5 6 5 2 6 6 6 2 7 6 7 2 8 6 8 2 9 6 9 3 0 7 0 3 1 7 1 3 2 7 2 3 3 7 3 3 4 7 4 3 5 7 5 3 6 7 6 3 7 7 7 3 8 7 8 3 9 7 9 4 0 8 0 T 4 ( 0 , 0 ) |
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