Pad Assignment

Pad Assignment

Pad Coordinates

Unit:

mm

Pad No.

X

Y

Pad No.

X

Y

1

-272.025

303.662

4

266.324

-297.913

2

-272.025

-298.538

5

257.400

312.150

3

132.225

-314.688

6

145.924

312.112

Pad Description

Pad No. Pad Name

I/O

Internal

Connection

Description

1

HF

I/O

CMOS

Connect to an antenna coil for normal operation. Open for data program-

ming.

2

HF1

I/O

CMOS

Connect to an antenna coil for normal operation. Data I/O for program-

ming.

3

VSS

¾¾

Negative power supply, ground

4

CLK

I

CMOS

Open for normal operation. Clock input for programming.

5

VPP

I

¾

Open for normal operation. High voltage supplies input for programming.

(Suggest 12.5V for programming)

6

VDD

¾¾

Open for normal operation, +6V supply input for programming.

Absolute Maximum Ratings

Supply Voltage (VDD) ...............................................6V

Storage Temperature ...........................

-50°Cto125°C

Supply Voltage (VPA) ..........................................12.5V

Operating Temperature ..............................0

°Cto70°C

Note: These are stress ratings only. Stresses exceeding the range specified under

²Absolute Maximum Ratings² may

cause substantial damage to the device. Functional operation of this device at other conditions beyond those

listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliabil-

ity.

HT6740

Rev. 1.20

2

May 17, 2007

( 0 , 0 )

H F

H F 1

1

2

3

4

5

6

Chip size: 965

* The IC substrate should be connected to VSS in the

PCB layout artwork.

1

2

3

4

8

7

6

5

H F

N C

N C

H F I

V C C

V P P

C L K

G N D

H T 6 7 4 0

8 D I P - A

Note:

The 8-pin DIP package type is supplied only for

engineering evaluation purposes and will not be

available in production volumes.