Package information

STA210N

4/6

3

Package information

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: http://www.st.com.

Figure 2.

VFQFPN68 mechanical data and package dimensions

OUTLINE AND

MECHANICAL DATA

DIM.

mm

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

A1

0.02

0.05

0.0008 0.0020

A2

0.65

1.00

0.0256 0.0394

A3

0.20

0.0079

b

0.18

0.25

0.30

0.0071 0.0098 0.0118

D

9.85

10.00

10.15 0.3878 0.3937 0.3996

D1

9.75

0.3839

D2

7.55

7.7

7.85

0.2972 0.3031 0.3091

E

9.85

10.00

10.15 0.3878 0.3937 0.3996

E1

9.75

0.3839

E2

7.55

7.7

7.85

0.2972 0.3031 0.3091

e

0.50

0.0197

L

0.45

0.55

0.65

0.0177 0.0217 0.0256

P

0.60

0.0236

ddd

0.08

0.0031

VFQFPN68

(10x10x1.0mm, pitch 0.50)

Very Fine Quad Flat Package No lead

7479590_C