Package information

LIS331AL

14/16

5

Package information

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK® is an ST trademark.

ECOPACK® specifications are available at: www.st.com.

Figure 5.

LGA 16: mechanical data & package dimensions

DIMENSIONS

REF.

mm

inch

MIN. TYP. MAX. MIN. TYP. MAX.

A1

1

0.039

A2

0.800.031

A3

0.20

0.008

D1

2.850

33.150

0.111

0.117

0.123

E1

2.850

33.150

0.111

0.117

0.123

L1

1

0.039

L2

2

0.078

N1

0.50

0.019

N2

1

0.039

T1

0.350

0.013

T2

0.250

0.001

M0.10

0.0039

P1

0.875

0.034

P2

1.275

0.05

k0.05

0.0019

LGA 16 (3x3x1.0mm)

Outline and

7983231E

mechanical data