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TLE2021MFKB 数据表(PDF) 4 Page - Texas Instruments

部件名 TLE2021MFKB
功能描述  EXCALIBUR HIGH-SPEED LOW-POWER PRECISION OPERATIONAL AMPLIFIERS
PDF  72 Pages
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制造商  TI [Texas Instruments]
网页  http://www.ti.com
标志 TI - Texas Instruments

TLE2021MFKB 数据表(HTML) 4 Page - Texas Instruments

  TLE2021MFKB Datasheet HTML 1Page - Texas Instruments TLE2021MFKB Datasheet HTML 2Page - Texas Instruments TLE2021MFKB Datasheet HTML 3Page - Texas Instruments TLE2021MFKB Datasheet HTML 4Page - Texas Instruments TLE2021MFKB Datasheet HTML 5Page - Texas Instruments TLE2021MFKB Datasheet HTML 6Page - Texas Instruments TLE2021MFKB Datasheet HTML 7Page - Texas Instruments TLE2021MFKB Datasheet HTML 8Page - Texas Instruments TLE2021MFKB Datasheet HTML 9Page - Texas Instruments Next Button
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TLE202x, TLE202xA, TLE202xB, TLE202xY
EXCALIBUR HIGHSPEED LOW POWER PRECISION
OPERATIONAL AMPLIFIERS
SLOS191C − FEBRUARY 1997 − REVISED APRIL 2007
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TLE2021Y chip information
This chip, when properly assembled, display characteristics similar to the TLE2021. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. This chip may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4
× 4 MILS MINIMUM
TJmax= 150°C
TOLERANCES ARE
±10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
+
−
OUT
IN +
IN −
VCC+
(7)
(3)
(2)
(6)
(4)
VCC −/GND
(1)
(5)
OFFSET N1
OFFSET N2
78
54
(1)
(2)
(3)
(4)
(5)
(6)
(7)



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