STA2062

Package information

3/5

2

Package information

This package has a Lead-free second level interconnect. The category of second level

interconnect is marked on the package and on the inner box label, in compliance with

JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also

marked on the inner box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 2.

LFBGA361 (16x16x1.4mm) mechanical data & package dimensions

OUTLINE AND

MECHANICAL DATA

DIM.

mm

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

A

1.400

0.0551

A1

0.210

0.0082

A2

0.985

0.0387

A3

0.200

0.0079

A4

0.800

0.0315

b

0.350

0.400

0.450 0.0138 0.0157 0.0177

D

15.850 16.000 16.150 0.6240 0.6299 0.6358

D1

14.400

0.5669

E

15.850 16.000 16.150 0.6240 0.6299 0.6358

E1

14.400

0.5669

e

0.800

0.0315

F

0.800

0.0315

ddd

0.100

0.0039

eee

0.150

0.0059

fff

0.080

0.0031

LFBGA361

Low profile Fine Pitch Ball Grid Array

Body: 16 x 16 x 1.4mm

8033008 B