AMMLP series

Low Power, Low Jitter MEMS Oscillator

Revision:

Initial Release 4/30/2024

Page 9

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Table 1

SnPb Eutectic Process

Classification Temperatures (Tc)

Package

Thickness

Volume mm3

<350

Volume mm3

>350

<2.5 mm

235 °C

220 °C

>2.5 mm

220 °C

220 °C

Table 2

Pb-Free Process

Classification Temperatures (Tc)

Package

Thickness

Volume mm3

<350

Volume mm3

350-2000

Volume mm3

>2000

<1.6 mm

260 °C

260 °C

260 °C

1.6 mm - 2.5 mm

260 °C

250 °C

245 °C

>2.5 mm

250 °C

245 °C

245 °C

Profile Feature

Sn-Pb Eutectic

Assembly

Pb-Free

Assembly

Preheat / soak

Temperature minimum (Tsmin)

100°C

150°C

Temperature maximum (Tsmax)

150°C

200°C

Time (Tsmin to Tsmax) (ts)

60 - 120 sec.

60 - 120 sec.

Average ramp-up rate (Tsmax to TP)

3°C/sec. max

3°C/sec. max

Liquidous temperature (TL)

183°C

217°C

Time at liquidous (tL)

60 - 150 sec.

60 - 150 sec.

Peak package body temperature (TP)

*

see Table 1

see Table 2

Time (tp

)** within 5°C of the specified classification temperature (TC)

20 sec.

30 sec.

Ramp-down rate (Tp to Tsmax)

6°C/sec. max

6°C/sec. max

Time 25°C to peak temperature

6 min. max

8 min. max

Reflow cycles

2 max

2 max

*Tolerance for peak profile temperature (TP) is defined as a supplier minimum and a user maximum.

**Tolerance for time at peak profile temperature (tp) is defined as supplier minimum and a user maximum.

Reflow Profile [JEDEC J-STD-020]