STPS2L40 datasheet(4/8 Pages) STMICROELECTRONICS

4 / 8 page

Characteristics

STPS2L40

4/8

Figure 9.

Relative variation of thermal

impedance junction to lead

versus pulse duration - SMB flat

Figure 10.

Reverse leakage current versus

reverse voltage applied (typical

values)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-04

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

Z/R

th(j-l)

SMB flat

δ=tp/T

t (s)

Single pulse

I (mA)

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

j=125°C

j=25°C

V (V)

Figure 11.

Junction capacitance versus

reverse voltage applied (typical

values)

Figure 12.

Forward voltage drop versus

forward current (high level)

Figure 13.

Forward voltage drop versus

forward current (low level)

Figure 14.

Thermal resistance junction to

ambient versus copper surface

under each lead (epoxy printed

board FR4, eCU=35µm)

100

1000

100

C(pF)

V (V)

F=1MHz

=30mV

T =25°C

OSC

RMS

0.1

1.0

10.0

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

(A)

(V)

T =25°C

(maximum values)

T =125°C

(maxmimum values)

T =125°C

(typical values)

0.0

0.5

1.0

1.5

2.0

2.5

3.0

0.0

0.1

0.2

0.3

0.4

0.5

0.6

(A)

(V)

T =25°C

(maximum values)

T =125°C

(maxmimum values)

T =125°C

(typical values)

100

110

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

(cm²)

SMB flat

SMB

(°C/W)

th(j-a)

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