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RT9005APSP 数据表(PDF) 9 Page - Richtek Technology Corporation |
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RT9005APSP 数据表(HTML) 9 Page - Richtek Technology Corporation |
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9 / 10 page ![]() RT9005A/B Preliminary 9 DS9005A/B-01 September 2007 www.richtek.com θJA vs. Copper Area 30 40 50 60 70 80 90 100 0 10 20304050 6070 Copper Area (mm 2) Figure 3 Figure 4. Dog-Bone layout Figure 5 (a). Minimum Footprint, θJA = 75°C/W Exposed Pad W≦2.28mm Figure 5. Thermal Resistance vs. Different Cooper Area Layout Design Figure 5 (b). Copper Area = 10mm2, θJA = 64°C/W Figure 5 (c). Copper Area = 30mm2, θJA = 54°C/W Figure 5 (d). Copper Area = 50mm2, θJA = 51°C/W Figure 5 (e). Copper Area = 70mm2, θJA = 49°C/W |
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