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CPC1908 数据表(PDF) 1 Page - Clare, Inc.

部件名 CPC1908
功能描述  i4-PAC??Power Relay
PDF  6 Pages
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制造商  CLARE [Clare, Inc.]
网页  http://www.clare.com
标志 CLARE - Clare, Inc.

CPC1908 数据表(HTML) 1 Page - Clare, Inc.

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www.clare.com
DS-CPC1908-R05
1
CPC1908
i4-PAC™ Power Relay
e3
RoHS
2002/95/EC
Part Number
Description
CPC1908J
i4-PAC Package (25 per tube)
Parameter
Rating
Units
Blocking Voltage
60
V
P
Load Current, T
A=25ºC
With 5°C/W Heat Sink
8.5
A
rms
No Heat Sink
3.5
On-Resistance
0.3
Ω
RθJC
0.35
°C/W
Applications
Features
Description
Ordering Information
Pin Configuration
Switching Characteristics of Normally
Open (Form A) Devices
CONTROL
I
LOAD
10%
90%
TON
TOFF
+
+
Approvals
UL recognized component: File # E69938
Certified to: UL 508
Compact i4-PAC™ Power Package
Low Thermal Resistance (0.35 °C/W)
8.5A
rms Load Current with 5°C/W Heat Sink
Electrically Non-conductive Thermal Pad for Heat
Sink Applications
Low Drive Power Requirements
Arc-Free With No Snubbing Circuits
2500V
rms Input/Output Isolation
No EMI/RFI Generation
Machine Insertable, Wave Solderable
Industrial Controls
Motor Control
Robotics
Medical Equipment—Patient/Equipment Isolation
Instrumentation
Multiplexers
Data Acquisition
Electronic Switching
I/O Subsystems
Meters (Watt-Hour, Water, Gas)
Transportation Equipment
Aerospace/Defense
Clare and IXYS have combined to bring OptoMOS®
technology, reliability and compact size to a new
family of high-power Solid State Relays.
As part of this family, the CPC1908 single pole
normally open (1-Form-A) Solid State Power Relay is
rated for up to 8.5A
rms continuous load current with a
5°C/W heat sink.
The CPC1908 employs optically coupled MOSFET
technology to provide 2500V
rms of input to output
isolation. The output is constructed with efficient
MOSFET switches and photovoltaic die that use
Clare’s patented OptoMOS architecture while the
input, a highly efficient GaAlAs infrared LED provides
the optically coupled control. The combination of
low on-resistance and high load current handling
capability makes this relay suitable for a variety of
high performance switching applications.
The unique i4-PAC package pioneered by IXYS
allows Solid State Relays to achieve the highest load
current and power ratings. This package features
a unique IXYS process where the silicon chips are
soft soldered onto the Direct Copper Bond (DCB)
substrate instead of the traditional copper leadframe.
The DCB ceramic, the same substrate used in high
power modules, not only provides 2500V
rms isolation
but also very low thermal resistance (0.35 °C/W).


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