www.irf.com

9

iP2001PbF

0.15 [.006] C

0.12 [.005] C

11.00

[.433]

2. DIMENS IONS ARE SHOWN IN MILLIMETERS [INCHES].

3. CONTROLLING DIMENSION: MILLIMETER

1. DIMENS IONING & TOLERANCING PER ASME Y14.5M-1994.

NOTES:

(4X 1.1 [.043])

B

11.00

[.433]

A

0.15 [.006] C

0.40

[.016]

0.80

[.032]

4X

22X

0.15 [.006]

C A B

0.08 [.003]

C

133X Ø

0.55 [.0216]

0.45 [.0178]

2X

2X

2.66 [.1047]

2.46 [.0969]

TOP VIEW

BOTTOM VIEW

SIDE VIEW

3.11 [.1224]

2.81 [.1107]

C

0.45 [.0177]

0.35 [.0138]

PACKAGE BODY.

BALL DIAMETER, IN A PLANE PARALLEL TO DATUM C.

SPHERICAL CROWNS OF THE SOLDER BALLS.

4. S OLDER BALL POS ITION DESIGNATION PER JES D 95-1, SPP-010.

7 S OLDER BALL DIAMETER IS MEASURED AT THE MAXIMUM SOLDER

5 PRIMARY DATUM C (SEATING PLANE) IS DEFINED BY THE

6 BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE

7

5

6

6

BALL A1

CORNER ID

Fig. 10: Mechanical Drawing

Refer to the following application notes for detailed guidelines and suggestions when

implementing iP0WIR Technology products:

AN-1028: Recommended Design, Integration and Rework Guidelines for International Rectifier’s BGA

and LGA Packages

This paper discusses optimization of the layout design for mounting iPowIR BGA and LGA packages on printed

circuit boards, accounting for thermal and electrical performance and assembly considerations . Topics

discussed includes PCB layout placement, routing, and via interconnect suggestions, as well as soldering, pick

and place, reflow, cleaning and reworking recommendations.

AN-1029: Optimizing a PCB Layout for an iPOWIR Technology Design

This paper describes how to optimize the PCB layout design for both thermal and electrical performance.

This includes placement, routing, and via interconnect suggestions.

AN-1030: Applying iPOWIR Products in Your Thermal Environment

This paper explains how to use the Power Loss and SOA curves in the data sheet to validate if the

operating conditions and thermal environment are within the Safe Operating Area of the iPOWIR product.