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74ACT244 数据表(PDF) 1 Page - Silicon Supplies

部件名 74ACT244
功能描述  Advanced CMOS TTL Input
PDF  6 Pages
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制造商  SS [Silicon Supplies]
网页  https://siliconsupplies.com/
标志 SS - Silicon Supplies

74ACT244 数据表(HTML) 1 Page - Silicon Supplies

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Advanced CMOS TTL Input – 74ACT244
 
 
 
 
Octal 3-State Non-Inverting Buffer / Line Driver / Line Receiver in bare die form
Rev 1.0
24/04/19
Outputs Source/Sink 24mA
Low input current: 1µA
Inputs directly accept TTL
 
 
 
 
The 74ACT244 is produced on a 1.5µm 5V CMOS process
combining high speed LSTTL performance with CMOS low
power. The device can be used as two 4-bit buffers or one
8-bit buffer & features non-inverting inputs with two output
enables, each controlling four of the 3-state outputs. The
device is designed to improve performance & density in
clock drivers, 3-state memory address drivers & bus
orientated transmitters and receivers. Inputs include clamp
diodes that enable the use of current limiting resistors to
interface inputs to voltages in excess of VCC. Device inputs
directly accept TTL without use of pull-up resistors.
Description
Outputs directly interface CMOS, NMOS and TTL
Operating voltage range: 4.5V to 5.5V
Function compatible with 74LS244
Lower power alternative to bipolar logic.
Features:
 
 
Ordering Information
Die Dimensions in µm (mils)
 
 
 
 
The following part suffixes apply:
No suffix - MIL-STD-883 /2010B Visual Inspection
For High Reliability versions of this product please see
1750 (69)
 
 
 
 
 
 
 
 
 
Die Size (Unsawn)
1750 x 1700
69 x 67
µm
mils
Minimum Bond Pad Size
130 x 130
5.12 x 5.12
µm
mils
Die Thickness
350 (±20)
13.78 (±0.79)
µm
mils
Top Metal Composition
Al 1%Si 1.1µm
Back Metal Composition
N/A – Bare Si
54ACT244
Supply Formats:
Mechanical Specification
Default – Die in Waffle Pack (100 per tray capacity)
Sawn Wafer on Tape – On request
Unsawn Wafer – On request
Die Thickness <> 350µm(14 Mils) – On request
Assembled into Ceramic Package – On request
Page 1 of 6 
www.siliconsupplies.com


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