SYSTEM

Processor

AMD® Ryzen™ Embedded R1606G, Dual Core, 1MB Cache, 3 CU, 2.6GHz (3.5GHz), 12W

AMD® Ryzen™ Embedded R1505G, Dual Core, 1MB Cache, 3 CU, 2.4GHz (3.3GHz), 12W

AMD® Ryzen™ Embedded R1000 series

Memory

4GB/8GB Memory Down

Single Channel DDR4 2400MHz

BIOS

SPI 64Mbit (default supports fTPM2.0)

GRAPHICS

Controller

Radeon™ Vega 3 Graphics

Feature

OpenGL 5.0, DirectX 12, OpenCL 2.1

HW Decode: AVC/H.264, MPEG2, VC1, WMV9, JPEG/MJPEG, HEVC/H.265, VP8, VP9, MVC

HW Encode: AVC/H.264, JPEG/MJPEG, HEVC/H.265, VP8, VP9, MVC

Display

1 x DDI (HDMI/DP++)

1 x LVDS/eDP

LVDS: single channel 24-bit, resolution up to 1366x768 @ 60Hz

HDMI: resolution up to 4096x2160 @ 24Hz

DP++: resolution up to 3840x2160 @ 60Hz

eDP: resolution up to 3840x2160 @ 60Hz

Dual Display

DDI + LVDS

DDI + eDP

EXPANSION

Interface

3 x PCIe x1 (Gen 3)

1 x SDIO

1 x LPC

1 x I2C

1 x SMBus

1 x SPI

2 x UART (TX/RX)

AUDIO

Interface

HD Audio

ETHERNET

Controller

Realtek RTL8111/RTL8119 (Option)

I/O

USB

2 x USB 3.1

8 x USB 2.0

SATA

2 x SATA 3.0 (up to 6Gb/s)

GPIO

1 x 8-bit GPIO

SECURITY

TPM

BIOS default support FTPM, TPM2.0 by request.

WATCHDOG TIMER Output & Interval System Reset, Programmable via Software from 1 to 255 Seconds

POWER

Type

4.75V~20V, 5VSB, VCC_RTC (ATX mode)

4.75V~20V, VCC_RTC (AT mode)

Consumption

Typical : R1606G : 5V @ 2.71A (13.55W)

Max : R1606G : 5V @ 5.52A (27.6W)

OS SUPPORT

(UEFI ONLY)

Windows 10 IoT Enterprise 64-bit

Linux

ENVIRONMENT

Temperature

Operating: 0 to 60°C

-40 to 85°C

Storage: -40 to 85°C

Humidity

Operating: 5 to 90% RH

Storage: 5 to 90% RH

MTBF

327,852 hrs @25C ; 162,213 hrs @45C ; 89,021 hrs @60C

Calculation Model : Telcordia Issue 4

Environment : GB, GC – Ground Benign, Controlled

MECHANICAL

Dimensions

COM Express® Mini

84mm (3.30") x 55mm (2.16")

Compliance

PICMG COM Express® R3.0, Type 10

GH9A3

Specifications

Packing List

Optional Items

www.dfi.com DFI reserves the right to change the specifications at any time prior to the product's release. Changes thereafter will be based on the product's revision. Please contact your sales

representative for the exact revision offered in your area. All product names mentioned are trademarks of their respective companies. © August 29, 2023 DFI Inc.

• 1 GH9A3 board

• 1 Heat sink (for 0 to 60°C)

A71-008164-000G

• 1 Cooler (for -40 to 85°C)

A71-108133-000G

• COM100-B Carrier Board Kit

770-COM104-000G

• COM335 Carrier Board Kit

770-CM3351-000G

Ordering Information

Model Name

P/N

Processor Memory

DIO/SDIO LVDS/eDP GbE USB 3.0 USB 2.0 Power Thermal Temp.

GH9A3-B40-R15

770-GH9A31-000G

R1505G

4G

DIO

LVDS

1

2

8

ATX/AT Heat Sink 0 to 60oC

GH9A3-T40-R16

770-GH9A31-100G

R1606G

4G

DIO

LVDS

1

2

8

ATX/AT Cooler

-40 to 85oC

GH9A3-T80-R16

770-GH9A31-200G

R1606G

8G

SDIO

LVDS

1

2

8

ATX/AT Cooler

-40 to 85oC