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RK701-BC41-RK3568 数据表(PDF) 3 Page - DFI Inc |
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RK701-BC41-RK3568 数据表(HTML) 3 Page - DFI Inc |
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3 / 3 page ![]() www.dfi.com SPECIFICATION SYSTEM Processor Rockchip RK3568 quad-core Cortex-A55 @2.0GHz Rockchip RK3568J quad-core Cortex-A55 @1.8GHz Memory 2GB/4GB/8GB DDR4 Memory Down 3200MHZ GRAPHICS Controller G52 2EE Feature OpenGL ES1.1/2.0/3.0/3.1/3.2, Vulkan 1.1, OpenCL 2.0 Display 1 x eDP/LVDS 1 x DP/TMDS HDMI: resolution up to 4096 x 2160 @30HZ LVDS: resolution up to1024 x 600 @60Hz eDP: resolution up to 3840 x 2160 @60Hz Dual Displays eDP/LVDS + DP/TMDS EXPANSION Interface 2 x PCIe x1 (Gen 3) 1 x PCIe x1 (Gen 2) 1 x uSD (available upon request) 1 x I2C 2 x SPI (SPI0 set to TPM 2.0) 1 x CAN bus 2 x UART 1 x MIPI-CSI (available upon request) AUDIO Interface HD Audio ETHERNET Controller 1 x RTL8211F-CG I/O USB 1 x USB 3.2 4 x USB 2.0 SATA 2 x SATA 3.0 (up to 6Gb/s, SATA 1 Co-Lay PCIE Gen 2) eMMC Supports up to 128GB eMMC, NC as default eMMC 5.1, BGA-153 Ball 8~128G(MLC mode) GPIO 1 x 4-bit GPIO SECURITY TPM TPM 2.0 POWER Type 5V, 5VSB, VCC_RTC Consumption TBD OS SUPPORT OS Support (UEFI Only) Linux ENVIRONMENT Temperature Operating: 0 to 60°C, -40 to 85°C Humidity Operating: 5 to 90% RH Storage: 5 to 90% RH MTBF TBD MECHANICAL Dimensions Qseven form factor 70mm (2.76") x 70mm (2.76") Compliance Qseven specification revision 2.1 STANDARDS AND CERTIFICATIONS Certification CE, FCC Class B, RoHS PACKING LIST OPTIONAL ITEMS ORDERING INFORMATION Model Name P/N CPU Memory eDP USB 3.2 USB 2.0 eMMC Operating Temp. RK701-BC41-RK3568 770-RK7011-000G RK3568 4 GB LVDS 1 4 16GB 0 to 60°C RK701-BC81-RK3568 770-RK7011-100G RK3568 8 GB LVDS 1 4 16GB 0 to 60°C RK701-TC81-RK3568J 770-RK7011-200G RK3568J 8 GB LVDS 1 4 16GB -40 to 85°C • 1 RK700 board • 1 Heat sink • Qseven Carrier Board • Heat spreader DFI reserves the right to change the specifications at any time prior to the product's release. Changes thereafter will be based on the product's revision. Please contact your sales representative for the exact revision offered in your area. All product names mentioned are trademarks of their respective companies. © October 31, 2024 DFI Inc. |
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