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IRL1404ZPBF 数据表(PDF) 2 Page - International Rectifier

部件名 IRL1404ZPBF
功能描述  AUTOMOTIVE MOSFET HEXFET짰 Power MOSFET
PDF  13 Pages
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制造商  IRF [International Rectifier]
网页  http://www.irf.com
标志 IRF - International Rectifier

IRL1404ZPBF 数据表(HTML) 2 Page - International Rectifier

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IRL1404Z/S/LPbF
2
www.irf.com
Notes:
 Repetitive rating; pulse width limited by
max. junction temperature. (See fig. 11).
‚ Limited by TJmax, starting TJ = 25°C,
L = 0.066mH, RG = 25Ω, IAS = 75A, VGS =10V.
Part not recommended for use above this value.
ƒ Pulse width ≤ 1.0ms; duty cycle ≤ 2%.
„ Coss eff. is a fixed capacitance that gives the same
charging time as Coss while VDS is rising from 0 to
80% VDSS .
… Limited by TJmax , see Fig.12a, 12b, 15, 16 for typical
repetitive avalanche performance.
† This value determined from sample failure population. 100%
tested to this value in production.
‡ This is only applied to TO-220AB package.
ˆ When mounted on 1" square PCB (FR-4 or G-10 Material).
For recommended footprint and soldering techniques
refer to application note #AN-994.
‰ TO-220 device will have an Rth value of 0.65°C/W.
S
D
G
S
D
G
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter
Min. Typ. Max. Units
V(BR)DSS
Drain-to-Source Breakdown Voltage40
–––
–––
V
∆V(BR)DSS/∆TJ Breakdown Voltage Temp. Coefficient
–––
0.034
–––
V/°C
–––
2.5
3.1
RDS(on)
Static Drain-to-Source On-Resistance
–––
–––
4.7
m
–––
–––
5.9
VGS(th)
Gate Threshold Voltage1.4
–––
2.7
V
gfs
Forward Transconductance
120
–––
–––
S
IDSS
Drain-to-Source Leakage Current
–––
–––
20
µA
–––
–––
250
IGSS
Gate-to-Source Forward Leakage
–––
–––
200
nA
Gate-to-Source Reverse Leakage
–––
–––
-200
Qg
Total Gate Charge
–––
75
110
Qgs
Gate-to-Source Charge
–––
28
–––
nC
Qgd
Gate-to-Drain ("Miller") Charge
–––
40
–––
td(on)
Turn-On Delay Time
–––19–––
tr
Rise Time
–––
180
–––
td(off)
Turn-Off Delay Time
–––30–––
ns
tf
Fall Time
–––49–––
LD
Internal Drain Inductance
–––
4.5
–––
Between lead,
nH
6mm (0.25in.)
LS
Internal Source Inductance
–––
7.5
–––
from package
and center of die contact
Ciss
Input Capacitance
–––
5080
–––
Coss
Output Capacitance
–––
970
–––
Crss
Reverse Transfer Capacitance
–––
570
–––
pF
Coss
Output Capacitance
–––
3310
–––
Coss
Output Capacitance
–––
870
–––
Coss eff.
Effective Output Capacitance
–––
1280
–––
Source-Drain Ratings and Characteristics
Parameter
Min. Typ. Max. Units
IS
Continuous Source Current
–––
–––
180
(Body Diode)
A
ISM
Pulsed Source Current
–––
–––
720
(Body Diode)
Ù
VSD
Diode Forward Voltage
–––
–––
1.3
V
trr
Reverse Recovery Time
–––
2639ns
Qrr
Reverse Recovery Charge
–––
18
27
nC
ton
Forward Turn-On Time
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
VGS = 4.5V, ID = 40A
e
VGS = 5.0V, ID = 40A e
VGS = 0V, VDS = 1.0V, ƒ = 1.0MHz
VGS = 0V, VDS = 32V, ƒ = 1.0MHz
VDS = 10V, ID = 75A
ID = 75A
VGS = 16V
VGS = -16V
VDS = 32V
VGS = 5.0V e
VDD = 20V
ID = 75A
RG = 4.0Ω
TJ = 25°C, IS = 75A, VGS = 0V e
TJ = 25°C, IF = 75A, VDD = 20V
di/dt = 100A/µs
e
Conditions
VGS = 0V, ID = 250µA
Reference to 25°C, ID = 1mA
VGS = 10V, ID = 75A
e
VDS = VGS, ID = 250µA
VDS = 40V, VGS = 0V
VDS = 40V, VGS = 0V, TJ = 125°C
MOSFET symbol
showing the
integral reverse
p-n junction diode.
Conditions
VGS = 5.0V e
VGS = 0V
VDS = 25V
ƒ = 1.0MHz
VGS = 0V, VDS = 0V to 32V f



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