Orderable Device

Status

(1)

Package

Type

Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

MSL Peak Temp

(3)

TPS62311YZDT

ACTIVE

DSBGA

YZD

8

250

Green (RoHS &

no Sb/Br)

SNAGCU

Level-1-260C-UNLIM

TPS62313YZDR

ACTIVE

DSBGA

YZD

8

3000 Green (RoHS &

no Sb/Br)

SNAGCU

Level-1-260C-UNLIM

TPS62313YZDT

ACTIVE

DSBGA

YZD

8

250

Green (RoHS &

no Sb/Br)

SNAGCU

Level-1-260C-UNLIM

TPS62315YZR

PREVIEW

DIESALE

YZ

8

3000

TBD

Call TI

Call TI

TPS62315YZT

PREVIEW

DIESALE

YZ

8

250

TBD

Call TI

Call TI

TPS62320DRCR

ACTIVE

SON

DRC

10

3000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

TPS62320DRCRG4

ACTIVE

SON

DRC

10

3000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

TPS62320YEDR

ACTIVE

DSBGA

YED

8

3000

TBD

SNPB

Level-1-240C-UNLIM

TPS62320YEDT

ACTIVE

DSBGA

YED

8

250

TBD

SNPB

Level-1-240C-UNLIM

TPS62320YZDR

ACTIVE

DSBGA

YZD

8

3000 Green (RoHS &

no Sb/Br)

SNAGCU

Level-1-260C-UNLIM

TPS62320YZDT

ACTIVE

DSBGA

YZD

8

250

Green (RoHS &

no Sb/Br)

SNAGCU

Level-1-260C-UNLIM

TPS62321DRCR

ACTIVE

SON

DRC

10

3000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

TPS62321DRCRG4

ACTIVE

SON

DRC

10

3000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

TPS62321YEDR

ACTIVE

DSBGA

YED

8

3000

TBD

SNPB

Level-1-240C-UNLIM

TPS62321YEDT

ACTIVE

DSBGA

YED

8

250

TBD

SNPB

Level-1-240C-UNLIM

TPS62321YZDR

ACTIVE

DSBGA

YZD

8

3000 Green (RoHS &

no Sb/Br)

SNAGCU

Level-1-260C-UNLIM

TPS62321YZDT

ACTIVE

DSBGA

YZD

8

250

Green (RoHS &

no Sb/Br)

SNAGCU

Level-1-260C-UNLIM

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and

package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS

compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame

retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

PACKAGE OPTION ADDENDUM

www.ti.com

15-Nov-2007

Addendum-Page 2