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STB40NF10 数据表(PDF) 4 Page - STMicroelectronics |
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STB40NF10 数据表(HTML) 4 Page - STMicroelectronics |
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4 / 13 page ![]() Electrical characteristics STB40NF10 4/13 2 Electrical characteristics (TCASE=25°C unless otherwise specified) Table 3. On/off states Symbol Parameter Test conditions Min. Typ. Max. Unit V(BR)DSS Drain-source breakdown voltage ID = 250µA, VGS =0 100 V IDSS Zero gate voltage drain current (VGS = 0) VDS = Max rating VDS = Max rating, TC = 125°C 1 10 µA µA IGSS Gate-body leakage current (VDS = 0) VGS = ± 20V ±100 nA VGS(th) Gate threshold voltage VDS = VGS, ID = 250µA 2 2.8 4 V RDS(on) Static drain-source on resistance VGS = 10V, ID = 25A 0.024 0.028 Ω Table 4. Dynamic Symbol Parameter Test conditions Min. Typ. Max. Unit gfs (1) 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %. Forward transconductance VDS = 25V, ID = 25A 20 S Ciss Coss Crss Input capacitance Output capacitance Reverse transfer capacitance VDS = 25V, f = 1MHz, VGS = 0 1780 265 112 pF pF pF td(on) tr td(off) tf Turn-on delay time Rise time Turn-off delay time Fall time VDD = 50V, ID = 25A RG =4.7Ω VGS = 10V (see Figure 13) 28 63 84 28 ns ns ns ns Qg Qgs Qgd Total gate charge Gate-source charge Gate-drain charge VDD = 80V, ID = 50A, VGS = 10V, RG =4.7Ω (see Figure 14) 60.6 9.6 22.8 80 nC nC nC |
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