The Embedded I/O Company

Technical Information

 Form Factor: Single-width 10 mm stacking height

FPGA Mezzanine Card (FMC) Mezzanine Module

conforming to ANSI/VITA 57.1

 Board size: 76.5 mm x 69 mm

 Air cooled Commercial Grade with Front Panel

 Regions 1 and 2 populated

 Low Pin Count (LPC) FMC Connector

 The 32 differential M-LVDS TIA/EIA-899 signals (up

to 200Mbit/s each) or RS-485/RS-422 signals (up to

16Mbit/s each) are accessible at a VHDCI-68/SCSI-V

female front I/O connector

 VADJ can range from 1.2V to 3.6V

 Direction of every bit is configurable independently

 On-board EEPROM contains IPMI hardware definition

 Operating temperature -40°C to +85°C

 MTBF (MIL-HDBK217F/FN2 GB 20°C)

TFMC684-10R: 873000 h

TFMC684-20R: 684000 h

Order Information

RoHS Compliant

TFMC684-10R

32 Ch. M-LVDS, LPC-FMC, VHD68 connector

TFMC684-20R

32 Ch. RS-485/RS-422, LPC-FMC, VHD68 connector

For the availability of non-RoHS compliant (leaded solder) products please contact TEWS.

Documentation

TFMC684-DOC User Manual

TEWS TECHNOLOGIES GmbH keeps the right to change technical specification without further notice.

All trademarks mentioned are property of their respective owners.

Issue 1.0.2

2017-08-24

TEWS TECHNOLOGIES GmbH

Am Bahnhof 7

25469 Halstenbek, Germany

Phone: +49 (0) 4101 4058 0

Fax: +49 (0) 4101 4058 19

e-mail: info@tews.com

www.tews.com