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AS1113

Data Sheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated in Section 6 Electrical

Characteristics on page 5 is not implied. Exposure to absolute maximum rating conditions for extended periods may

affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Comments

0

7

V

Input Voltage

-0.4

+0.4

V

Output Voltage

-0.4

15

V

GND Pin Current

1000

mA

Thermal Resistance

88

ºC/W

on PCB, 24-pin SSOP package

23

ºC/W

on PCB, 28-pin QFN (5x5mm) package

Ambient Temperature

-40

+85

ºC

Storage Temperature

-55

150

ºC

Humidity

5

86

%

Non-condensing

Electrostatic

Discharge

Digital Outputs

2000

V

Norm: MIL 833 E method 3015

All Other Pins

2000

Latch-Up Immunity

-100 -

+100 +

mA

EIA/JESD78

Package Body Temperature

+260

ºC

The reflow peak soldering temperature (body

temperature) specified is in accordance with

IPC/JEDEC J-STD-020C “Moisture/Reflow

Sensitivity Classification for Non-Hermetic Solid

State Surface Mount Devices”.

The lead finish for Pb-free leaded packages is

matte tin (100% Sn).