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©2006 Littelfuse

600R Series

Specifications are subject to change without notice.



Electronics Designers Guide

Radial Leaded

Soldering Parameters - Wave Soldering

Condition

Wave Soldering

Peak Temp/ Duration Time

260°C < 5 Sec

> 220°C

2 Sec ~ 20 Sec

Preheat 140°C~ 180°C

180 Sec ~ 210 Sec

Storage Condition

0°C~35°C, < 70%RH

• Recommended soldering methods: heat element oven or

N

• Devices are designed to be wave soldered to the bottom

side of the board.

• Devices can be cleaned using standard industry methods

and solvents.

• This profile can be used for lead-free device

Note: If soldering temperatures exceed the recommended

profile, devices may not meet the performance

requirements.

Preheating

160

190

220

260

0

2 to 5

Soldering

Cooling

20-30

180 to 210

Time(s)

Protection Application Guide

Region/Specification

Application

Device Selection

North America

Telcordia GR-1089

*Access network equipment

Remote terminal

Repeaters

WAN equipment

Cross -connect

600R150

600R160

North America

TIA-968-A, UL60950

Customer and IT equipment

Analog modems

ADSL, XDSL modems

Phone sets, PBX systems

Internet appliances

POS terminals

600R150

600R160

North America

Telcordia GR-1089

Central Office

POTS/ISDN linecards

T1/E1/J1 linecards

ADSL/VDSL splitters

CSU/DSU

600R150

600R160

North America

Telcordia GR-1089

*Intrabuilding communication systems

LAN, VOIP cards

Local loop handsets

600R150

600R160

South America/Asia/Europe

ITU K.20 and K.21

*Resistance binned parts are recommended