The dimension for X1, X2 and X3 are as given:

•

•

•

microSMD-30

NS Package Number TLA3011A

See National Semiconductor Application Note 1112 Micro SMD Wafer Level Chip Scale Package for PCB design and assembly

instructions.

National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves

the right at any time without notice to change said circuitry and specifications.

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