Integrated Crystal and SRAM

2

_____________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

RECOMMENDED DC OPERATING CONDITIONS

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

INT/SQW Relative to Ground.............................-0.3V to +6.0V

Operating Temperature Range

(noncondensing) .............................................-40°C to +85°C

Junction Temperature ......................................................+125°C

Storage Temperature Range ...............................-40°C to +85°C

Lead Temperature

(soldering, 10s) .....................................................+260°C/10s

Soldering Temperature (reflow, 2 times max) .......See IPC/JEDEC

J-STD-020 Specification

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

2.3

3.3

5.5

Supply Voltage

2.3

3.0

5.5

V

Logic 1 Input SDA, SCL

0.7 x

0.3

V

Logic 0 Input SDA, SCL

-0.3

+0.3 x

V

Pullup Voltage

(SDA, SCL, INT/SQW)

5.5V

V

ELECTRICAL CHARACTERISTICS

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

200

Active Supply Current

32kHz output off

(Notes 3, 4)

325

μA

120

Standby Supply Current

output off, SQW output off

(Note 4)

160

μA

500

Temperature Conversion Current

output off, SQW output off

600

μA

Power-Fail Voltage

2.45

2.575

2.70

V

Logic 1 Output, 32kHz

Active supply > 3.3V,

3.3V > active supply > 2.7V,

2.7V > active supply > 2.3V

2.0

V