2

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Technical Information

COMPLIANCE

COM Express® mini, Pin-out Type 10

DIMENSIONS

84 mm x 55 mm

CPU

Intel Atom® x7000E / x7000RE Series

For details see table (CPU variants) given below

CHIPSET

Integrated in SOC

MAIN MEMORY

Up to 32 GByte LPDDR5 4800 MT/s memory down (In-Band ECC)

GRAPHICS CONTROLLER

SOC: Intel® HD Gfx Gen12: LVDS/eDP, 1x DP

ETHERNET CONTROLLER

SOC + LAN PHY GPY115 (GPY215 on request)

ETHERNET

1GBit Ethernet (2.5GBit on request with GPY215)

STORAGE

2x SATA 6Gb/s

FLASH ONBOARD

eMMC option – up to 256 GByte eMMC TLC

PCI EXPRESS®

PCIe Gen 3.0 - PCIe lane configurations: 4 x1, 2 x1 + 1 x2, 2 x2

DISPLAY

DDI: DP++, LVDS: Single Channel 18/24 bit or eDP

USB

2x USB 3.2 Gen2 (incl. USB 2.0) + 6x USB 2.0

SERIAL

2x serial interface (RX/TX only)

AUDIO

Intel® High Definition Audio

OTHER FEATURES

SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC

SPECIAL FEATURES

Industrial grade temperature

FEATURES ON REQUEST

eMMC up to 256 GByte TLC, eDP instead of LVDS, eSPI instead of LPC,

General Purpose SPI instead of Boot SPI, Trusted Platform module TPM 2.0, de-populated LAN PHY,

2.5GBit LAN instead of 1Gbit

POWER MANAGEMENT

ACPI 6.0

POWER SUPPLY

4.75 V – 20 V Wide Range, Single Supply Power

BIOS

AMI Aptio V

OPERATING SYSTEM

Windows® 10/11, Linux

TEMPERATURE

COMe-mAS10- commercial temperature:

0° C to +60° C operating, -30° C to +85° C non-operating

COMe-mAS10 E2 - industrial temperature:

-40° C to +85° C operating, -40° C to +85° C non-operating

HUMIDITY

93% relative Humidity at 40°C, non-condensing (according to IEC 60068-2-78)

COMe-mAS10 (E2)