MAX9730 datasheet(2/15 Pages) MAXIM

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2.4W, Single-Supply, Class G Power Amplifier

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ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

(VCC = CPVDD = SHDN = 3.6V, GND = CPGND = 0V, RIN+ = RIN- = 10kΩ, RFB+ = RFB- = 10kΩ, RFS = 100kΩ, C1 = 4.7µF, C2 =

10µF; speaker load resistors (RL) are terminated between OUT+ and OUT-, unless otherwise stated; TA = TMIN to TMAX, unless other-

wise noted. Typical values are at TA = +25°C.) (Notes 1, 2)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

(Voltages with respect to GND.)

VCC, CPVDD .............................................................-0.3V to +6V

PVSS, SVSS ...............................................................-6V to +0.3V

CPGND..................................................................-0.3V to +0.3V

OUT+, OUT-...................................(SVSS - 0.3V) to (VCC + 0.3V)

IN+, IN-, FB+, FB- ......................................-0.3V to (VCC + 0.3V)

C1N..........................................(PVSS - 0.3V) to (CPGND + 0.3V)

C1P.......................................(CPGND - 0.3V) to (CPVDD + 0.3V)

FS, SHDN ...................................................-0.3V to (VCC + 0.3V)

Continuous Current Into/Out of

OUT+, OUT-, VCC, GND, SVSS .....................................800mA

CPVDD, CPGND, C1P, C1N, PVSS.................................800mA

Any Other Pin ..................................................................20mA

Continuous Power Dissipation (TA = +70°C)

20-Bump UCSP (derate 10.3mW/°C above +70°C) .....827mW

28-Pin TQFN (derate 20.8mW/°C above +70°C) ........1667mW

Operating Temperature Range ...........................-40°C to +85°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering, 10s) ................................+300°C

Bump Temperature (soldering) Reflow............................+235°C

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

GENERAL

Supply Voltage Range

VCC

Inferred from PSRR test

2.7

5.5

Quiescent Current

ICC

812

Chip Power Dissipation

PDISS

VOUT = 2.8VRMS, f = 1kHz, RL = 8

0.9

Shutdown Current

ISHDN

SHDN = GND

0.3

µA

Turn-On Time

tON

Time from shutdown or power-on to full

operation

Input DC Bias Voltage

VBIAS

IN_ inputs

1.1

1.24

1.4

ILOAD = 0mA (slow mode)

110

Charge-Pump Oscillator

Frequency (Slow Mode)

fOSC

ILOAD > 100mA (normal mode)

230

330

430

kHz

Maximum Capacitive Load

200

VIH

1.4

SHDN Input Threshold (Note 3)

VIL

0.4

SHDN Input Leakage Current

±1

µA

SPEAKER AMPLIFIER

TA = +25°C

±3

±15

Output Offset Voltage

VOS

TMIN

≤ TA ≤ TMAX

±20

Common-Mode Rejection Ratio

CMRR

fIN = 1kHz (Note 4)

Click-and-Pop Level

VCP

Peak voltage into/out of shutdown

A-weighted, 32 samples per second

(Notes 5, 6)

-52

dBV

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