TPS853

2007-10-01

5

• Second reflow soldering

In case of second reflow soldering, it should be performed within 168 h after first reflow under the

above conditions.

Storage conditions before second reflow soldering: 30°C, 70% RH or lower

• Do not perform flow soldering.

• Make any necessary soldering correction manually.

(do not do this more than once for any given pin.)

Temperature: no more than 350°C (25 W for soldering iron)

Time: within 5 s

(2) Recommended soldering pattern

(3)

Cleaning conditions

When cleaning is required after soldering

Chemicals: AK225 alcohol

Temperature and time: 50°C

× 30 s or 30°C × 3 minutes

Ultrasonic cleaning: 300 W or less

Packing Specification

(1)

Packing quantity

Reel (minimum packing quantity)

3,000 devices

Carton

5 reels (15,000 devices)

(2)

Packing format

An aluminum envelope containing silica gel and reels is deaerated and sealed.

Pack shock-absorbent materials around the aluminum envelopes in the cartons to cushion them.

• Carton specification

Carton dimensions

(W) 81 mm

× (L) 280 mm × (H) 280 mm

Label

0.65

0.65

0.4

Unit: mm