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AX2012 数据表(PDF) 3 Page - AXElite technology co. ltd |
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AX2012 数据表(HTML) 3 Page - AXElite technology co. ltd |
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3 / 13 page ![]() 3/13 Axelite Confidential Materials, do not copy or distribute without written consent. Rev.1.4 Sep.27, 2019 AX2012 ORDER/MARKING INFORMATION Order Information AX2012 XX X Package Type Packing Blank : Bag A : Taping CT: TSOT-23-6L Z8: TDFN-8L (2*2) Top Marking (TSOT-23-6L) Top Marking (TDFN-8L) J AX2012 Week: 01~26(A~Z) 27~52(a~z) Year: 8=2018 9=2019 B=2020 C=2021 D=2022 ID Code: Internal A Y W X : Z= 2044 AX2012 Year: 8=2018 9=2019 B=2020 C=2021 D=2022 Week: 01~26(A~Z) 27~52(a~z) ID Code: Internal Y W X J A : Z = 2044 ABSOLUTE MAXIMUM RATINGS (at TA=25°C) Characteristics Symbol Rating Unit VCC Pin Voltage VCC GND - 0.3 to GND + 6 V EN,FB, OV Pin Voltage GND - 0.3 to VCC + 0.3 V SW, OV Pin Voltage VSW 30 V Power Dissipation PD ( TJ-TA ) / θJA mW Storage Temperature Range TST -65 to +150 °C Operating Junction Temperature Range TOP -40 to +125 °C Thermal Resistance from Junction to case TSOT-23-6L θJC 180 °C/W TDFN-8L 25 Thermal Resistance from Junction to ambient TSOT-23-6L θJA 250 °C/W TDFN-8L 120 Note: θJA is measured with the PCB copper area of approximately 1 in2(Multi-layer). |
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