MPX4100

Sensors

4

Freescale Semiconductor

Figure 2. Cross-Sectional Diagram (Not to Scale)

Figure 3. Recommended Power Supply Decoupling

(For output filtering recommendations, refer to Application Note AN1646.)

Figure 2 illustrates an absolute sensing chip in the basic

chip carrier (Case 867). A fluorosilicone gel isolates the die

surface and wire bonds from the environment, while allowing

the pressure signal to be transmitted to the sensor

diaphragm. The MPX4100A series pressure sensor

operating characteristics, and internal reliability and

qualification tests are based on use of dry air as the pressure

media. Media, other than dry air, may have adverse effects on

sensor performance and long-term reliability. Contact the

factory for information regarding media compatibility in your

application.

Figure 4 shows the sensor output signal relative to

pressure input. Typical, minimum, and maximum output

curves are shown for operation over a temperature range of

0° to 85°C. (The output will saturate outside of the specified

pressure range.)

Figure 4. Output versus Absolute Pressure

Fluoro Silicone

Gel Die Coat

Die

P1

Metal Cover

Epoxy Plastic

Case

Absolute Element

P2

Lead Frame

Wire Bond

Die

Bond

Stainless Steel

Sealed Vacuum Reference

IPS

1

2

3

OUTPUT

1.0 µF

0.01 µF

+5.0 V

Transfer Function:

VS = 5.1 Vdc

Pressure (ref. to sealed vacuum) in kPa

MAX

TYP

MIN

5.0

4.5

3.5

4.0

3.0

2.5

2.0

1.5

1.0

0

0.5

TEMP = 0 to 85°C

20 kPa TO 105 kPa

MPX4100A