LEAD FREE REFLOW SOLDERING CONDITION

(Applicable to Chip Type Aluminum Electrolytic Capacitors)

Recommended Conditions for Reflow Soldering

(1) A thermal condition system such as infrared radiation (IR) or hot blast should be adopted, and

vapor heat transfer systems (VPS) are not recommended.

(2) Reflow soldering should be performed one time. If the capacitor has to be reflowed twice, 30

minutes must be layout between each time.

(3) For lead-free type reflow soldering, please observe proper conditions below:

a) The time of preheating from 150°C to 200°C shall be within maximum 180 seconds;

b) The time of soldering temperature at 217°C measured on capacitors' top shall not exceed

tL (second);

c) The peak temperature on capacitors' top shall not exceed Tp(°C), and the time within 5°C

of actual peak temperature shall not exceed tp (second).

Classification Reflow Profile

*1. Average ramp-up rate is 3

/second max.

*2. Ramp-down rate is 6

/second max.

*3. Time from 25

to peak temperature is 8 minutes max.

tp

20 0

25

21 7

Tp

15 0

25 t o Peak * 3

Ramp-down

*2

P reheat 180 s ec Max

Ti m e

Critical Zone

217t oTp

Allowable Range of Peak Temperature

Size

Thickness (mm)

Volume (mm

Tp(°C)

tp (second)

4~ 6.3,

8 6.2L

2.5

<350

250±0

90

5

8 10.5L

2.5

350~2000

240±0

90

5

10 10.5L/13.5L

2.5

350~2000

235±0

60

5

12.5,

16

2.5

>2000

230±0

30 (20*)

5

Re: (20*) is special for mid-to-high voltage which is HU series.

Recommended Land Size (Unit: mm)

Size

ab

c

4

1.6

2.6

1.6

5

1.6

3.0

1.6

6.3

1.6

3.5

1.6

8×6.2L

2.1

4.5

1.6

8×10.5L

3.0

3.5

2.5

10

4.0

4.0

2.5

12.5

4.0

5.7

3.0

16×16.5/21.5

6.0

6.5

3.5

DB LECTRO Inc. 3755 Place Java, Suite 140, Brossard, Québec, J4Y 0E4, Canada - T: 1-450-444-1424 / F: 1-450-444-4714 / www.dblectro.com