Data Sheet

ADPL40502

analog.com

Rev. 0

6 of 17

Therefore, ΨJB thermal paths include convection from the top of the package as well as radiation from the package,

factors that make ΨJB more useful in real-world applications. To calculate the maximum TJ from the board

temperature (TB) and PD, use the following equation:

TJ = TB + (PD × ΨJB)

See JESD51-8 and JESD51-12 for more detailed information about ΨJB.

Thermal Resistance

θJA and ΨJB are specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount

packages.

Table 4. Thermal Resistance

Package Type

θJA

ΨJB

Unit

5-Lead TSOT (UJ-5)

170

43

°C/W

6-Lead LFCSP (CP-6-3)

63.6

28.3

°C/W

ESD Caution

ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can

discharge without detection. Although this product features patented or proprietary

protection circuitry, damage may occur on devices subjected to high energy ESD. Therefore,

proper ESD precautions should be taken to avoid performance degradation or loss of

functionality.