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MCP2558FD 数据表(PDF) 21 Page - Microchip Technology |
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MCP2558FD 数据表(HTML) 21 Page - Microchip Technology |
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21 / 36 page  2016 Microchip Technology Inc. DS20005533A-page 21 MCP2557FD/8FD 4.0 PACKAGING INFORMATION 4.1 Package Marking Information Example: 8-Lead DFN (03x03x0.9 mm) Part Number Code MCP2557FDT-H/MF DAEO MCP2557FD-H/MF DAEO MCP2558FDT-H/MF DAEQ MCP2558FD-H/MF DAEQ DAEN 1609 256 Example: 8-Lead SOIC (150 mil) MCP2557 SN 1609 256 Part Number Code MCP2557FDT-H/SN MCP2557 MCP2557FD-H/SN MCP2557 MCP2558FDT-H/SN MCP2558 MCP2558FD-H/SN MCP2558 Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC®designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC® designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e Example: 8-Lead TDFN (02x03x0.8 mm) Part Number Code MCP2557FDT-H/MNY ACZ MCP2558FDT-H/MNY ADA ACZ 609 25 3 e |
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