LS R976, LO R976, LY R976

2001-02-12

9

Lötbedingungen

Vorbehandlung nach JEDEC Level 2

Soldering Conditions Preconditioning acc. to JEDEC Level 2

IR-Reflow Lötprofil

(nach IPC 9501)

IR Reflow Soldering Profile

(acc. to IPC 9501)

Empfohlenes Lötpaddesign

IR Reflow Löten

Recommended Solder Pad

IR Reflow Soldering

Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch)

OHLA0685

0:00

0

T

t

˚C

min

50

100

150

200

250

0:30

1:00

1:30

2:00

2:30

3:00

3:30

4:00

4:30

5:00

5:30

2-3 K/s

2-3 K/s

= 70 s

t

max

T

= 245 ˚C

1.2 (0.047)

0.9 (0.035)

OHAPY607

1.2 (0.047)