TLP554

2007-10-01

2

Recommended Operating Conditions

CHARACTERISTIC

SYMBOL

MIN.

TYP.

MAX.

UNIT

Low Level input Voltage

VFL

-3

0

1.0

V

High Level input current

IFH

6.3*

⎯

20

mA

Supply Voltage

VCC

4.5

5

5.5

V

High-Level Enable Voltage

VEH

2.0

⎯

VCC

V

Low-Level Enable Voltage

VEL

0

⎯

0.8

V

Fan Out(TTL Load)

N

⎯

⎯

8

⎯

Operating Temperature

Topr

0

⎯

70

°C

Note:

Recommended operating conditions are given as a design guideline to obtain expected performance of the

device. Additionally, each item is an independent guideline respectively. In developing designs using this

product, please confirm specified characteristics shown in this document.

*6.3mA condition permits at least 20% CTR degradation

Initial switching threshold is 5.0mA or less.

CHARACTERISTIC

SYMBOL

RATING

UNIT

Forward Current

20

mA

Reverse Voltage

5

V

Output Current

IO

25

mA

Output Voltage

VO

-0.5~7

V

Supply Voltage

(Note 2)

VCC

7

V

Enable Voltage

(Note 3)

VE

5.5

V

Output Power Dissipation

PO

40

mW

Storage Temperature Range

−55~125

°C

Operating Temperature Range

−40~85

°C

Lead Soldering Temperature (10 s)

(Note 4)

260

°C

Isolation Voltage (AC, 1 minute, R.H.≤ 60%)

(Note 5)

2500

Vrms

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even

if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum

ratings and the operating ranges.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

be either a ceramic or solid tantalum capacitor with good high frequency characteristic and should be

(Note 2) 1 Minute Maximum.

(Note 3) Not to exceed VCC by more than 500mV.

(Note 4) 2mm below seating plane.

(Note 5) Device considered a two-terminal device :Pins 1,2,3 and 4 shorted together,and Pins 5, 6,7 and 8 shorted

together.