Technical Reference Note (APC08)

MODEL: APC08 SERIES

SHEET 21 OF 23

OCTOBER 4, 2004 - REVISION 03

RECOMMENDED REFLOW PROFILE

0

20

40

60

80

100

120

140

160

180

200

220

240

0

30

60

90

120

150

180

210

240

270

300

TIME (seconds)

PRE-HEAT ZONE

120 - 180 sec

REFLOW

ZONE

< 80 sec

110

°C

183

°C

PEAK TEMPERATURE

200

°C - 230°C

SLOPE

< 4

°C /sec

RECOMMENDED LOCATION FOR PICK AND PLACE

The flat top surface of the large inductor (topside of the board) provides a versatile and convenient way of picking up the

module (see Figure 46). A 6-7mm outside diameter nozzle from a conventional SMD machine is recommended to attain

maximum vacuum pick-up. Nozzle travel and rotation speed should be controlled to prevent this off-centered picked-up

module from falling off the nozzle. The use of vision recognition systems for placement accuracy will be very helpful.

REFLOW NOTES / RECOMMENDATIONS

1.

Refer to the recommended Reflow Profile per

Figure 47. Profile parameters exceeding the

recommended maximums may result to

permanent damage to the module.

2.

The module is recommended for topside

reflow process to the host card. For other

orientations, contact factory.

3.

In the event that the module needs to be

desoldered from the host card, some pins

may be detached from the module.

MODULE MARKINGS / LABELS

Marking shall be permanent and legible.

Please refer to Figure 48 for the module

marking/ label detail.

MMM

Model No

FFF

Option

YYWW

Year / Work Week

D

Day of Week

PP

nth Panel of the day

LL

Location in the panel

6 & 7 characters / line

Code 128, 32CPI

0.070" Height

Figure 48. Module Label

APC08MMMFFF

YYWWDPPLL

¨

¨

¨

Figure 47. Recommended Reflow Profile.