ST72F521 datasheet(200/215 Pages) STMICROELECTRONICS

200 / 215 page

ST72F521, ST72521B

200/215

13.3 SOLDERING INFORMATION

In accordance with the RoHS European directive,

all STMicroelectronics packages will be converted

in 2005 to lead-free technology, named ECO-

PACKTM (for a detailed roadmap, please refer to

PCN CRP/04/744 "Lead-free Conversion Program

- Compliance with RoHS", issued November 18th,

2004).

■ ECOPACK

TM packages are qualified according

to the JEDEC STD-020B compliant soldering

profile.

■ Detailed information on the STMicroelectronic

ECOPACKTM transition program is available on

www.st.com/stonline/leadfree/,

with

specific

technical Application notes covering the main

technical

aspects

lead-free

conversion

(AN2033,

AN2034,

AN2035,

AN2036).

Backward and forward compatibility:

The main difference between Pb and Pb-free sol-

dering process is the temperature range.

– ECOPACKTM TQFP packages are fully compat-

ible with Lead (Pb) containing soldering process

(see application note AN2034)

– TQFP Pb-packages are compatible with Lead-

free soldering process, nevertheless it's the cus-

tomer's duty to verify that the Pb-packages max-

imum temperature (mentioned on the Inner box

label) is compatible with their Lead-free soldering

temperature.

Table 29. Soldering Compatibility (wave and reflow soldering process)

* Assemblers must verify that the Pb-package maximum temperature (mentioned on the Inner box label)

is compatible with their Lead-free soldering process.

Package

Plating material devices

Pb solder paste

Pb-free solder paste

TQFP

NiPdAu (Nickel-palladium-Gold)

Yes

Yes *

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