Data Sheet

ADP151

APPLICATIONS INFORMATION

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Rev. J | 18 of 23

Figure 51. LFCSP 500 mm2 of PCB Copper, TA = 25°C

Figure 52. LFCSP 100 mm2 of PCB Copper, TA = 25°C

Figure 53. LFCSP 50 mm2 of PCB Copper, TA = 25°C

Figure 54. LFCSP 500 mm2 of PCB Copper, TA = 50°C

Figure 55. LFCSP 100 mm2 of PCB Copper, TA = 50°C

Figure 56. LFCSP 50 mm2 of PCB Copper, TA = 50°C

In the case where the board temperature is known, use the thermal

characterization parameter (ΨJB) to estimate the junction tempera-

ture rise (see Figure 57 and Figure 58). Maximum TJ is calculated

from the TB and PD using the following formula: