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BMP280 数据表(PDF) 39 Page - Bosch Sensortec GmbH |
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BMP280 数据表(HTML) 39 Page - Bosch Sensortec GmbH |
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39 / 49 page ![]() Bosch Sensortec | BMP280 Data sheet 39 | 49 Modifications reserved | Data subject to change without notice Document number: BST-BMP280-DS001-26 Revision_1.26_102021 7.2 Landing pattern recommendation For the design of the landing pattern, the following dimensioning is recommended: Figure 19: Recommended landing pattern (top view); dimensions are in mm Note: red areas demark exposed PCB metal pads. • In case of a solder mask defined (SMD) PCB process, the land dimensions should be defined by solder mask openings. The underlying metal pads are larger than these openings. • In case of a non solder mask defined (NSMD) PCB process, the land dimensions should be defined in the metal layer. The mask openings are larger than the these metal pads. 0.5 0.55 2.0 8 7 6 5 1 2 3 4 |
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