Data Sheet

ADP1762

Rev. D | Page 5 of 19

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter

Rating

VIN to GND

−0.3 V to +2.16 V

EN to GND

−0.3 V to +3.96 V

VOUT to GND

−0.3 V to VIN

SENSE to GND

−0.3 V to VIN

VREG to GND

−0.3 V to VIN

REFCAP to GND

−0.3 V to VIN

VADJ to GND

−0.3 V to VIN

SS to GND

−0.3 V to VIN

PG to GND

−0.3 V to +3.96 V

Storage Temperature Range

−65°C to +150°C

Operating Temperature Range

−40°C to +125°C

Operating Junction Temperature

125°C

Lead Temperature (Soldering, 10 sec)

300°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL DATA

Absolute maximum ratings apply individually only, not in

combination. The ADP1762 can be damaged when the junction

temperature limits are exceeded. The use of appropriate thermal

management techniques is recommended to ensure that the

maximum junction temperature does not exceed the limits shown

in Table 4.

Use the following equation to calculate the junction temperature

(TJ) from the board temperature (TBOARD) or package top

temperature (TTOP)

TJ = TBOARD + (PD × ΨJB)

TJ = TTOP + (PD × ΨJT)

ΨJB is the junction to board thermal characterization parameter

and ΨJT is the junction to top thermal characterization

parameter with units of °C/W.

ΨJB of the package is based on modeling and calculation using a

4-layer board. JESD51-12, Guidelines for Reporting and Using

Electronic Package Thermal Information, states that thermal

characterization parameters are not the same as thermal

resistances. ΨJB measures the component power flowing

through multiple thermal paths rather than a single path as in

thermal resistance, θJB. Therefore, ΨJB thermal paths include

convection from the top of the package as well as radiation

from the package, factors that make ΨJB more useful in real-

world applications.

THERMAL RESISTANCE/PARAMETER

Values shown in Table 5 are calculated in compliance with JEDEC

standards for thermal reporting. θJA is the natural convection

junction to ambient thermal resistance measured in a one cubic

foot sealed enclosure. θJC is the junction to case thermal resistance.

θJB is the junction to board thermal resistance. ΨJB is the junction to

board thermal characterization parameter. ΨJT is the junction to

top thermal characterization parameter.

In applications where high maximum power dissipation exists,

close attention to thermal board design is required. Thermal

resistance/parameter values may vary, depending on the PCB

material, layout, and environmental conditions.

Table 5. Thermal Resistance/Parameter

Package

Type

θJA

θJB

θJC-T

θJC-B

ΨJB

ΨJT

Unit

CP-16-221

50.95

29.31

49.53

8.53

29.31

0.3

°C/W

1 Thermal resistance/parameter simulated values are based on a JEDEC 2S2P

thermal test board for ΨJT, ΨJB, θJA and θJB and a JEDEC 1S0P thermal test

board for θJC with four thermal vias. See JEDEC JESD51-12.

ESD CAUTION