SF-0603SP-R Series – Metal Foil SMD Fuses

Solder Reflow Recommendations

Profile Feature

Pb-Free Assembly

Preheat / Soak:

Temperature Min. (Tsmin)

Temperature Max. (Tsmax)

Time (ts) from (Tsmin to Tsmax)

150 °C

200 °C

60~120 seconds

Ramp Up Rate (TL to Tp)

3 °C / second max.

Liquidous Temperature (TL)

Time (tL) maintained above TL

217 °C

60~150 seconds

Peak Package Body

Temperature (Tp)

260 °C

Time (tp)* within 5 °C of the

specified classification temperature (Tc) 30 seconds*

Ramp Down Rate (Tp to TL)

6 °C / second max.

Time 25 °C to Peak Temperature

8 minutes max.

TIME

tL

TIME 25 °C TO PEAK

tp

ts

Tsmax

Tsmin

Tp

260

150

10 sec. max.

PREHEATING

TL

25

Tc -5 °C

PREHEAT AREA

MAX. RAMP UP RATE = 3 °C/s

MAX. RAMP DOWN RATE = 6 °C/s

120 seconds

TIME

* Tolerance for peak profile temperature (Tp) is defined as a

supplier minimum and a user maximum.

REV. 02/24

Specifications are subject to change without notice.

Users should verify actual device performance in their specific applications.

The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.