Fig. 6b : SMC Package.

Mounting on FR4 PC Board with recommended

pad layout.

Fig. 5 : Peak forward voltage drop versus peak

forward current.

Fig. 6a : CB429 Package.

Fig. 4 : Capacitance versus reverse applied

voltage (typical values).

Fig. 6a/6b : Transient thermal impedance junction-ambient versus pulse duration.

Fig. 7 : Relative variation of leakage current

versus junction temperature.

1N5908/SM5908

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