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STM32G474CEU6 数据表(PDF) 204 Page - STMicroelectronics |
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STM32G474CEU6 数据表(HTML) 204 Page - STMicroelectronics |
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204 / 232 page  Package information STM32G474xB STM32G474xC STM32G474xE 204/232 DS12288 Rev 1 6.2 UFQFPN48 package information Figure 55. UFQFPN - 48 leads, 7x7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat package outline 1. Drawing is not to scale. 2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life. 3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this back-side pad to PCB ground. Table 112. WLCSP81 recommended PCB design rules Dimension Recommended values Pitch 0.4 mm Dpad 0,225 mm Dsm 0.290 mm typ. (depends on soldermask registration tolerance) Stencil opening 0.250 mm Stencil thickness 0.100 mm |
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