SRP5020CC Series - Shielded Power Inductors

Features

■

Shielded construction

■

Carbonyl powder core

■

High saturation current

■

Low radiation

■

Low buzz noise

■

RoHS compliant* and halogen free**

Additional Information

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General Specifications

Operating Temperature

.................................. -40 °C to +125 °C

(Temperature rise included)

Storage Temperature (Component)

...................................... -40 °C to +125 °C

Temperature Rise .....40 °C at rated Irms

1

Rated Current

.............. Inductance drops 30 % at Isat

Moisture Sensitivity Level ......................1

ESD Classification (HBM).................. N/A

1Circuit design, component, PCB trace size and

thickness, airflow and other cooling provisions

all affect the part temperature. Part temperature

should be verified in the end application.

Materials

Core..............................Carbonyl powder

Wire .............................Enameled copper

Terminal Finish ................................... Sn

Packaging...... 3000 pcs. per 13-inch reel

Electrical Specifications @ 25 °C

Bourns Part No.

Inductance

@ 100 kHz / 1 V

Q Min.

SRF

(MHz)

Typ.

DCR

(mΩ)

Typ.

DCR

(mΩ)

Max.

Irms

(A)

Typ.

Isat

(A)

Typ.

L (μH)

Tol. %

SRP5020CC-R10Y

0.10

30

5

190

2.7

3

20

36

SRP5020CC-R15Y

0.15

30

5

190

3.6

4

18

24

SRP5020CC-R22M

0.22

20

5

145

4.1

4.6

16

23

SRP5020CC-R33M

0.33

20

5

117

5.5

6.1

14

17

SRP5020CC-R47M

0.47

20

5

100

6.8

7.6

11.5

16

SRP5020CC-R68M

0.68

20

5

90

10.6

11.7

10

13

SRP5020CC-1R0M

1.0

20

10

64

13.8

15.2

9

10.5

SRP5020CC-1R5M

1.5

20

10

52

25.6

28.7

7

9.6

SRP5020CC-2R2M

2.2

20

10

38

36

41

5.5

8.8

SRP5020CC-3R3M

3.3

20

10

35

66

74

4

7

SRP5020CC-4R7M

4.7

20

10

30

95

109

3.2

6

SRP5020CC-6R8M

6.8

20

10

23

130

150

2.8

5

SRP5020CC-8R2M

8.2

20

10

20

150

171

2.6

4

SRP5020CC-100M

10

20

10

18

180

199

2.5

3.6

Soldering Profile

25

260

Time (Seconds)

REFLOW TIMES: 3 TIMES MAX.

PREHEAT AREA

MAX. RAMP UP RATE = 3 °C/SEC.

MAX. RAMP DOWN RATE = 6 °C/SEC.

Time 25 °C to Peak

8 Minutes Max.

TC -5 °C

200 °C

60~150

Sec.

217

150°C

60~120

Sec.

< 30 Sec.

Profile Feature

Pb Free Assembly

Preheat

- Temperature Min. (Tsmin)

- Temperature Max. (Tsmax)

- Time(ts) from Tsmin to Tsmax

150 °C

200 °C

60-120 seconds

Ramp-up Rate (TL to Tp)

3 °C/second max.

Liquidous temperature (TL)

Time (tL) maintained above TL

217 °C

60-150 seconds

Peak package body temperature (Tp)

260 °C

Time within 5 °C of Actual Peak Temperature

(tp)

<30 seconds

Ramp-Down Rate (Tp to TL)

6 °C/second max.

Time 25 °C to Peak Temperature

8 minutes max.

* RoHS Directive 2015/863, Mar 31, 2015 and Annex.

** Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br)

and Chlorine (Cl) content is 1500 ppm or less.

Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are

subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.

WARNING Cancer and Reproductive Harm

www.P65Warnings.ca.gov

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